The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Oct. 07, 2015
Ecole Polytechnique, Palaiseau, FR;
Centre National DE LA Recherche Scientifique, Paris, FR;
Institut Francais Des Sciences ET Technologies Des Transports DE L'amenagement ET Des Reseaux, Champs-sur-Marne, FR;
Costel-Sorin Cojocaru, Palaiseau, FR;
Fatima Zahra Bouanis, Châtillon, FR;
Kitchner Max Garry Rose, Massy, FR;
Ecole Polytechnique, Palaiseau, FR;
Centre National de la Recherche Scientifique, Paris, FR;
Institut Francais des Sciences et Technologies des Transports de l'Amenagement et des Reseaux, Champs-sur Marne, FR;
Abstract
The invention relates to a method for manufacturing an electronic device, particularly a device including a flexible and/or low-cost substrate and/or carbon nanotubes, and also relates to electronic devices produced using said method. The method for manufacturing an electronic device, including a substrate mad of a material M and an active semiconductor material layer (), includes the following steps: a) providing a carrier () made of an alkali metal salt or alkaline earth metal salt, preferably sodium chloride (NaCl) or potassium chloride (KCl); optionally, b) depositing a dielectric material layer () onto one surface of the carrier; c) forming an active semiconductor material layer () on one surface of the carrier when Step b) is not implemented or on the free surface of the layer when Step b) is implemented; d) forming different components of the electronic device on and/or under the layer; e) depositing a protective layer onto the layer stack, obtained in Step d), of the different components of the electronic device, said protective layer being made of the material M required for the substrate (); and f) removing the carrier () by dissolving one or more of the components of said electronic device on a substrate different from the substrate (). In said removal of the carrier, the method does not include any step for manufacturing one or more of the components of said electronic device on a substrate different from the substrate (). The invention is of use in the field of electronics in particular.