The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Sep. 16, 2014
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Yuichi Yamamoto, Kanagawa, JP;

Kojiro Nagaoka, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/225 (2006.01); G02B 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14687 (2013.01); G02B 13/0085 (2013.01); H01L 27/14607 (2013.01); H01L 27/14627 (2013.01); H01L 27/14683 (2013.01); H04N 5/2253 (2013.01);
Abstract

The present disclosure relates to a solid-state imaging element in which the cost reduction of a curved imaging element can be achieved, a method for manufacturing the solid-state imaging element, and an electronic apparatus. A curvature base is formed so as to be curved in a concave shape at a center leaving a small edge. The curvature base is divided into five portions of an element disposition portion and four peripheral portions. This element disposition portion is formed in a porous state. A pore (air bubble) in the porous state is smaller than a pixel size. A porous material such as a ceramic-based material, a metal-based material, or a resin-based material can be used as the porous material, for example. The present disclosure can be applied to a CMOS solid-state imaging element to be used for an imaging device, for example.


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