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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10157938 B1

PDFFull Text
Date of Patent:
Dec. 18, 2018

Filed:

Nov. 07, 2016

Array substrate, fabrication method for forming the same, and display device containing the same

Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, CN;

Inventors:

Shiju Zhang, Beijing, CN;

Xingfeng Ren, Beijing, CN;

Guoquan Liu, Beijing, CN;

Assignees:

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD, Hefei, CN;

Attorney:

Anova Law Group, PLLC

Primary Examiner:

Stephen W Smoot

Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 27/12 (2006.01); H01L 21/66 (2006.01); G01R 31/26 (2014.01); G11C 16/10 (2006.01); H01L 21/77 (2017.01); H01L 23/00 (2006.01); H01L 27/115 (2017.01); H01L 27/32 (2006.01); G02F 1/1362 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1244 (2013.01); G01R 31/26 (2013.01); G02F 1/136227 (2013.01); G02F 1/136259 (2013.01); G11C 16/10 (2013.01); H01L 21/77 (2013.01); H01L 22/34 (2013.01); H01L 24/49 (2013.01); H01L 27/115 (2013.01); H01L 27/1248 (2013.01); H01L 27/14636 (2013.01); H01L 27/14692 (2013.01); H01L 27/3276 (2013.01); G02F 2001/136263 (2013.01); H01L 27/124 (2013.01);
Abstract

The present application discloses a fabrication method for forming an array substrate, including: forming, in a fanout region, a first signal-load line connected to a first group of data lead wires, and a second signal-load line connected to a second group of data lead wires; and forming, in the fanout region, at least one unidirectional device at a connection point of the first signal-load line and a data lead wire, at least one unidirectional device at a connection point of the second signal-load line and a data lead wire. The first signal-load line and the second signal-load line are each configured to transmit an external testing signal along a single direction to the data lead wires through the unidirectional devices.

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