The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Aug. 26, 2016
Applicant:

Semikron Elektronik Gmbh & Co., KG, Nürnberg, DE;

Inventor:

Ingo Bogen, Nürnberg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/053 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/043 (2006.01); H01L 23/10 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/043 (2013.01); H01L 23/10 (2013.01); H01L 23/12 (2013.01); H01L 23/367 (2013.01); H01L 23/3675 (2013.01); H01L 23/49838 (2013.01); H01L 24/24 (2013.01); H01L 24/72 (2013.01); H01L 25/072 (2013.01); H01L 24/06 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A submodule comprising: a substrate, a power semiconductor component, a connection device, a terminal device and an insulating body. The substrate has conductor tracks electrically insulated from one another, and the component is electrically conductively connected to a track. The connection device is a film composite with a first surface facing the component and the substrate and an opposed second surface. The insulating body has: a first partial body, connected to an edge of the substrate, a first cutout for a terminal, a second partial body, embodied as a pressure body and a second cutout, with a pressure element projecting therefrom. The second partial body is movable relative to the first partial body in the direction of the substrate to press with the pressure element onto a section of the second surface. The section is within the area of the component in projection along the direction of the normal thereto.


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