The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Sep. 25, 2015
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Yukio Morita, Kyoto, JP;
Kenji Sugimoto, Kyoto, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/11 (2006.01); H01L 21/56 (2006.01); H01L 23/04 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01P 3/08 (2006.01); H01L 21/48 (2006.01); H01L 33/48 (2010.01); H05K 1/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 21/4846 (2013.01); H01L 23/04 (2013.01); H01L 23/13 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 33/486 (2013.01); H01P 3/087 (2013.01); H05K 1/11 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/181 (2013.01);
Abstract
A wiring board () includes an insulating substrate () having a cutout () opened in a main surface and a side surface of the insulating substrate (), and an inner electrode () formed on an inner surface of the cutout (). The inner electrode () includes a plurality of metal layers. The inner electrode () includes, as an intermediate layer, at least one metal layer () selected from the group consisting of a nickel layer, a chromium layer, a platinum layer, and a titanium layer, and includes a gold layer as an outermost layer (). The metal layer () is exposed at an outer edge portion of the inner electrode ().