The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Oct. 17, 2014
Applicant:
Stmicroelectronics (Rousset) Sas, Rousset, FR;
Inventors:
Christian Rivero, Rousset, FR;
Pascal Fornara, Pourrières, FR;
Antonio di-Giacomo, Rousset, FR;
Brice Arrazat, Marignane, FR;
Assignee:
STMICROELECTRONICS (ROUSSET) SAS, Rousset, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 61/02 (2006.01); H01H 1/58 (2006.01); H01H 9/02 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
H01H 61/02 (2013.01); B81B 3/0021 (2013.01); H01H 1/58 (2013.01); H01H 9/02 (2013.01); B81B 2201/031 (2013.01); B81B 2203/053 (2013.01);
Abstract
A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.