The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Dec. 21, 2015
Applicant:
Commonwealth Scientific and Industrial Research Organisation, Acton, AU;
Inventors:
Timothy William Jones, Waratah, AU;
Gregory Joseph Wilson, Cameron Park, AU;
Kenrick Forrest Anderson, Mayfield, AU;
Anthony Frank Hollenkamp, Camberwell, AU;
Noel William Duffy, Ormonde, AU;
Nienke Joan Firet, The Hague, NL;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01G 9/20 (2006.01); H01L 31/0392 (2006.01); H01L 31/032 (2006.01); H01L 51/42 (2006.01); C25D 3/34 (2006.01); C25D 5/48 (2006.01); C25D 13/02 (2006.01); C23C 18/31 (2006.01); C23C 14/14 (2006.01); C23C 14/58 (2006.01); C23C 14/34 (2006.01); C23C 24/04 (2006.01); C25D 3/30 (2006.01); C25D 3/54 (2006.01); H01L 51/00 (2006.01); H01L 51/44 (2006.01); C23C 18/12 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
H01G 9/2059 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 14/5846 (2013.01); C23C 18/1689 (2013.01); C23C 18/31 (2013.01); C23C 24/04 (2013.01); C25D 3/30 (2013.01); C25D 3/34 (2013.01); C25D 3/54 (2013.01); C25D 5/48 (2013.01); C25D 13/02 (2013.01); H01L 31/0324 (2013.01); H01L 31/0392 (2013.01); H01L 51/0002 (2013.01); H01L 51/0032 (2013.01); H01L 51/4226 (2013.01); C23C 18/1216 (2013.01); C23C 18/1694 (2013.01); H01L 51/447 (2013.01); Y02E 10/549 (2013.01);
Abstract
A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.