The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Apr. 09, 2015
Applicant:
Koa Corporation, Ina-shi, Nagano, JP;
Inventors:
Kosuke Arai, Nagano, JP;
Tadahiko Yoshioka, Nagano, JP;
Assignee:
KOA CORPORATION, Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C 17/28 (2006.01); H01C 1/01 (2006.01); H01C 1/14 (2006.01); H01C 1/16 (2006.01); H01C 17/00 (2006.01); H01C 17/24 (2006.01); H01C 17/245 (2006.01);
U.S. Cl.
CPC ...
H01C 17/28 (2013.01); H01C 1/01 (2013.01); H01C 1/14 (2013.01); H01C 1/16 (2013.01); H01C 17/006 (2013.01); H01C 17/24 (2013.01); H01C 17/245 (2013.01); Y10T 29/49082 (2015.01); Y10T 29/49101 (2015.01);
Abstract
Provided is a method for producing a resistor, including a step of forming a through-hole in a sheet-like conductive material; a step of fitting a resistive element piece into the through-hole and thus forming joint portions where end surfaces of the resistive element piece are joined to respective side surfaces of the conductive material exposed by the through-hole; and stamping a region including the joint portions from the conductive material, thereby forming a resistor including a resistive element and a pair of electrodes.