The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Jan. 19, 2015
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventors:

Hyun-Jeong Kim, Hwaseong-si, KR;

Hyuk-Hwan Kim, Hwaseong-si, KR;

Seokhyun Nam, Seoul, KR;

Si joon Song, Suwon-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); H05K 1/02 (2006.01); B23K 101/38 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133603 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 3/0638 (2013.01); B23K 3/08 (2013.01); G02F 1/133606 (2013.01); G02F 1/133611 (2013.01); H05K 1/0274 (2013.01); B23K 2201/38 (2013.01); G02F 2001/133607 (2013.01); H05K 1/181 (2013.01); H05K 2201/09909 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01);
Abstract

A manufacturing method of a backlight unit includes providing a solder paste on a printed circuit board and forming a solder part in a first area of the printed circuit board, aligning a bank mask on the printed circuit board to align a first opening defined through the bank mask with a second area of the printed circuit board not overlapped with the first area, providing a bank material in the first opening and forming a bank on the printed circuit board in an area corresponding to the second area, separating the bank mask from the printed circuit board including the bank thereon, and connecting the solder part of the printed circuit board and a light emitting unit to each other.


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