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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10155918 B1

PDFFull Text
Date of Patent:
Dec. 18, 2018

Filed:

Dec. 22, 2014

Solid composition comprising a polysaccharide and a hydrophobic compound, the process and use thereof

Applicant:

Rhodia Operations, Paris, FR;

Inventors:

Hai Zhou Zhang, Singapore, SG;

Nikolay Christov, Singapore, SG;

Da Wei Jin, Singapore, SG;

Lin He, Singapore, SG;

Assignee:

Rhodia Operations, Paris, FR;

Attorney:

Jarrod N. Raphael

Primary Examiner:

John R Hardee

Int. Cl.
CPC ...
C11D 3/37 (2006.01); C11D 3/22 (2006.01); C11D 3/00 (2006.01); C11D 3/20 (2006.01); C11D 1/62 (2006.01); C11D 1/66 (2006.01); C11D 3/38 (2006.01); C08L 1/08 (2006.01); C08L 5/02 (2006.01); C08L 5/12 (2006.01); C11D 3/43 (2006.01); D06M 13/46 (2006.01); D06M 15/03 (2006.01); D06M 23/08 (2006.01);
U.S. Cl.
CPC ...
C11D 3/227 (2013.01); C08L 1/08 (2013.01); C08L 5/02 (2013.01); C08L 5/12 (2013.01); C11D 1/62 (2013.01); C11D 1/667 (2013.01); C11D 3/001 (2013.01); C11D 3/0015 (2013.01); C11D 3/2013 (2013.01); C11D 3/2093 (2013.01); C11D 3/222 (2013.01); C11D 3/225 (2013.01); C11D 3/38 (2013.01); C11D 3/43 (2013.01); D06M 13/46 (2013.01); D06M 15/03 (2013.01); D06M 23/08 (2013.01); D06M 2200/50 (2013.01);
Abstract

The present invention provides a solid composition comprising a polysaccharide and a hydrophobic compound having a melting point of between 30° C. and 90° C. The solid composition may further comprise a quaternary ammonium compound, wherein the weight ratio of the polysaccharide and the hydrophobic compound is between 1:50 and 50:1. Preferably, the solid composition is substantially free or completely free of water. The solid composition shows excellent stability at a temperature up to 45° C. The present invention also provides a process for preparing the solid composition and a liquid composition comprising said solid composition, and a method for conditioning a fabric by using said solid composition or said liquid composition as well.

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