The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Nov. 21, 2017
Applicant:
Laird Technologies, Inc., Earth City, MO (US);
Inventors:
Karen Bruzda, Cleveland, OH (US);
Kathryn Cancar, Lakewood, OH (US);
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/04 (2006.01); C09K 5/14 (2006.01); C08K 3/08 (2006.01); C08K 3/28 (2006.01); C08K 3/34 (2006.01); C08K 3/38 (2006.01); C08K 3/22 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/04 (2013.01); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/34 (2013.01); C08K 3/38 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/0856 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); H01L 23/373 (2013.01);
Abstract
Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.