The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Jul. 28, 2015
Applicant:

Dow Corning Corporation, Midland, MI (US);

Inventors:

Steven Swier, Midland, MI (US);

Yanhu Wei, Midland, MI (US);

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 183/16 (2006.01); C08K 3/00 (2018.01); C04B 26/32 (2006.01); C08L 83/06 (2006.01); C09D 5/00 (2006.01); C09D 183/06 (2006.01); C08L 83/04 (2006.01); C04B 111/00 (2006.01); C08G 77/12 (2006.01); C08G 77/14 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C09D 183/16 (2013.01); C04B 26/32 (2013.01); C08K 3/00 (2013.01); C08L 83/04 (2013.01); C08L 83/06 (2013.01); C09D 5/00 (2013.01); C09D 183/06 (2013.01); C04B 2111/00482 (2013.01); C04B 2111/00844 (2013.01); C08G 77/12 (2013.01); C08G 77/14 (2013.01); C08G 77/20 (2013.01); Y02W 30/94 (2015.05);
Abstract

The present disclosure provides methods of making organosiloxane polymer compositions from hydrosilylation curable compositions comprising at least the components (a) and (b) and at least one of components (c) and (d): (a) an organosiloxane resin material comprising aliphatic unsaturation; and (b) an organosiloxane crosslinker comprising multiple silicon atom-bonded hydrogen atoms (e.g., an 'SiH siloxane'); in combination with at least one of (c) at least one organosiloxane comprising at least two silicon atom-bonded hydrogen atoms; and (d) at least one organosiloxane comprising at least two silicon atom-bonded hydrocarbyl groups comprising aliphatic unsaturation (e.g., a 'di-vinyl functional siloxane'). Such hydrosilylation curable compositions have, in some instances, significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, including devices having tall structures.


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