The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Mar. 16, 2017
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventors:
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09D 4/00 (2006.01); C09D 7/40 (2018.01); B32B 27/20 (2006.01); G02B 1/14 (2015.01); B05D 1/18 (2006.01); B05D 1/28 (2006.01); B05D 1/30 (2006.01); C09D 5/00 (2006.01); C09D 7/62 (2018.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01); C08K 7/26 (2006.01);
U.S. Cl.
CPC ...
C09D 4/00 (2013.01); B05D 1/18 (2013.01); B05D 1/28 (2013.01); B05D 1/305 (2013.01); B32B 27/20 (2013.01); C09D 5/00 (2013.01); C09D 7/40 (2018.01); C09D 7/62 (2018.01); C09D 7/67 (2018.01); C09D 7/68 (2018.01); C09D 7/70 (2018.01); G02B 1/14 (2015.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01); C08K 7/26 (2013.01); C08K 2201/003 (2013.01); C08K 2201/011 (2013.01);
Abstract
The invention is directed to a method for manufacturing a hardcoat film including a hardcoat layer having a surface of which a water contact angle is 65° or less by applying, drying, and curing a composition for forming the hardcoat layer on a base material film, in which the composition for forming the hardcoat layer contains the components (a) to (d) as defined herein, and, in a case in which a total solid content of the composition for forming the hardcoat layer is set to 100% by mass, a content of the component (b) is 40% to 80% by mass, a content of the component (c) is 10% to 40% by mass, and a content of the component (d) is 10% to 40% by mass.