The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Jan. 22, 2015
Applicant:

Dow Corning Toray Co., Ltd., Tokyo, JP;

Inventor:

Hiroji Enami, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/44 (2006.01); C08K 5/5415 (2006.01); C08L 83/04 (2006.01); C08L 83/14 (2006.01); H01L 23/29 (2006.01); C08K 5/00 (2006.01); C08K 5/06 (2006.01); C08K 5/5435 (2006.01); C08K 5/549 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C08G 77/44 (2013.01); C08K 5/0091 (2013.01); C08K 5/06 (2013.01); C08K 5/549 (2013.01); C08K 5/5415 (2013.01); C08K 5/5435 (2013.01); C08L 83/04 (2013.01); C08L 83/14 (2013.01); H01L 23/296 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A silicone gel composition for use in sealing or filling of electrical or electronic parts comprising at least one adhesion promoter (Z), and by curing to form a silicone gel having, at 25° C. and a shear frequency of 0.1 Hz, a loss elastic modulus of from 5.0×10to 1.0×10dyne/cm, a complex elastic modulus of from 5.0×10to 1.0×10dyne/cm, and a loss tangent of 0.3 or less. The silicone gel composition is provided, which can suppress the occurrence of air bubbles or cracks in silicone gel that seals or fills an electrical or electronic part and has excellent bonding to the electrical or electronic part even when used under high-temperature conditions as in a power device; and a silicone gel is provided, which can suppress the occurrence of air bubbles or cracks when it seals or fills an electrical or electronic part.


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