The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Oct. 08, 2015
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Chitoshi Ueki, Kyoto, JP;

Takuji Hashiguchi, Kyoto, JP;

Keiichi Kotani, Kyoto, JP;

Akinori Hirashima, Kyoto, JP;

Assignee:

KYOCERA Corporation, Kyoto-shi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B41J 2/14056 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/162 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1632 (2013.01); B41J 2/1634 (2013.01); B41J 2002/14217 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14459 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/19 (2013.01); B41J 2202/20 (2013.01);
Abstract

A head includes the passageway member which is configured by a plurality of plates stacked through the adhesive and in which the ink passageways are configured by communication of the through holes individually formed in the plurality of plates to each other. The plurality of plates includes the resin plate and a plurality of metal plates. The resin plate does not have a relief groove for the adhesive. The plurality of metal plates include the eighth metal plate and/or ninth metal plate which is adhered to the resin plate and includes the relief groove for the adhesive on the resin plate side.


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