The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

May. 03, 2017
Applicant:

Precision Valve & Automation, Inc., Cohoes, NY (US);

Inventors:

Andrew John Nally, Ballston Spa, NY (US);

Alexander M. Giordano, Ballston Lake, NY (US);

Edward F. Carey, Ballston Spa, NY (US);

Jonathan Neal Urquhart, Saratoga Springs, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 41/00 (2006.01); B32B 41/00 (2006.01); G05B 19/409 (2006.01); B29C 65/48 (2006.01); B29C 65/00 (2006.01); H04N 7/18 (2006.01); B29D 11/00 (2006.01); B32B 17/10 (2006.01); B32B 37/00 (2006.01); B32B 37/12 (2006.01); B29L 11/00 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
B32B 41/00 (2013.01); B29C 65/48 (2013.01); B29C 66/90 (2013.01); B29D 11/00 (2013.01); B32B 17/10807 (2013.01); B32B 37/003 (2013.01); G05B 19/409 (2013.01); H04N 7/183 (2013.01); B29L 2011/00 (2013.01); B32B 37/12 (2013.01); B32B 37/1284 (2013.01); B32B 2037/1253 (2013.01); B32B 2041/04 (2013.01); B32B 2041/06 (2013.01); B32B 2307/412 (2013.01); B32B 2309/70 (2013.01); B32B 2457/20 (2013.01); G05B 2219/49032 (2013.01); G06T 7/0008 (2013.01); G06T 2207/10016 (2013.01);
Abstract

An automated bonding sequence system and method for customizing a bonding sequence is provided. The method includes the steps of detecting that a first substrate is in close proximity with the a second substrate, during an optical bonding operation, wherein at least the first substrate includes an amount of adhesive for optically bonding to the second substrate, stopping an automated process of optically bonding of the optical bonding operation, in response to the detecting, recording operator feedback control signals, the operator feedback control signals being received from a controller being operated by an operator to contact the first substrate and the second substrate, analyzing the operator feedback control signals to determine a bonding sequence for automatically optically bonding the first substrate and the second substrate, and resuming, by the processor, the automated process of the optical bonding operation.


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