The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Jul. 09, 2015
Applicant:

National Taiwan University of Science and Technology, Taipei, TW;

Inventors:

Chao-Chang Chen, Taipei, TW;

Feng-Chi Lee, Taipei, TW;

Kun-Lin Wang, Taipei, TW;

Ching-Hsien Yeh, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/56 (2006.01); B29L 31/34 (2006.01); B29L 11/00 (2006.01); B29C 45/76 (2006.01); B29C 45/37 (2006.01);
U.S. Cl.
CPC ...
B29C 45/568 (2013.01); B29C 45/561 (2013.01); B29C 45/372 (2013.01); B29C 45/76 (2013.01); B29C 2045/565 (2013.01); B29C 2945/7604 (2013.01); B29C 2945/76006 (2013.01); B29C 2945/76257 (2013.01); B29C 2945/76381 (2013.01); B29C 2945/76384 (2013.01); B29C 2945/76933 (2013.01); B29C 2945/76943 (2013.01); B29L 2011/0016 (2013.01); B29L 2031/3406 (2013.01);
Abstract

An in-mold vibratile injection compression molding method and molding apparatus thereof are described. While performing a filling stage, a first piezoelectric actuator and a second piezoelectric actuator are use to vibrate the molding material along at least two directions for precisely filling the molding material into the micro-structure by adjusting the filling flow velocity of the molding material associated with the proper molding material temperature and by maintaining a molding material temperature of a skin solidified layer in the cavity between a glass transition temperature and a melting temperature in order to avoid the form error, to increase the groove filling rate and to improve the residual stress.


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