The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Apr. 22, 2016
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

William Kai Langford, Cambridge, MA (US);

Matthew Eli Carney, Brookline, MA (US);

Benjamin Jenett, Cambridge, MA (US);

Neil Gershenfeld, Cambridge, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); B25J 9/16 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B29C 64/00 (2017.01); B23P 19/04 (2006.01); B25J 5/02 (2006.01); G01L 5/00 (2006.01); G05B 19/402 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
B25J 9/1687 (2013.01); B23P 19/04 (2013.01); B25J 5/02 (2013.01); B29C 64/00 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); G01L 5/0085 (2013.01); G05B 19/402 (2013.01); G05B 2219/45064 (2013.01); G05B 2219/49023 (2013.01); G06F 17/50 (2013.01); Y10S 901/09 (2013.01);
Abstract

An alternative to additive manufacturing is disclosed, introducing an end-to-end workflow in which discrete building blocks are reversibly joined to produce assemblies called digital materials. Described is the design of the bulk-material building blocks and the devices that are assembled from them. Detailed is the design and implementation of an automated assembler, which takes advantage of the digital material structure to avoid positioning errors within a large tolerance. To generate assembly sequences, a novel CAD/CAM workflow is described for designing, simulating, and assembling digital materials. The structures assembled using this process have been evaluated, showing that the joints perform well under varying conditions and that the assembled structures are functionally precise.


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