The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Apr. 22, 2013
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Keiichiro Oishi, Osaka, JP;
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Abstract
A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0≤[Cu]−3.6×[Si]≤67.5. In addition, the area fraction of the α phase 'α'%, the area fraction of a β phase 'β'%, the area fraction of a γ phase “γ”%, the area fraction of the κ phase “κ”%, and the area fraction of a μ phase “μ”% satisfy 30≤“α”≤84, 15≤“κ”≤68, “α”+“κ”≥92, 0.2≤“κ”/“α”≤2, “β”≤3, “μ”≤5, “β”+“μ”≤6, 0≤“γ”≤7, and 0≤“β”+“μ”+“γ”≤8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.