The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Feb. 28, 2018
Applicant:

Chaun-choung Technology Corp., New Taipei, TW;

Inventors:

I-Yung Lin, New Taipei, TW;

Po-Chih Liu, New Taipei, TW;

Wen-Tang Chen, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 7/20 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); G06F 1/1616 (2013.01); G06F 1/203 (2013.01);
Abstract

An electronic device and a heat dissipation structure thereof are provided. The electronic device comprises a first shell body; a second shell body, mutually pivoted with the first shell body; and a heat dissipation structure, including a first heat conducting member and a second heat conducting member, wherein the first heat conducting member is disposed in the first shell body and extended with a first arc-shaped piece, the second heat conducting member is disposed in the second shell body and extended with a second arc-shaped piece, and the second arc-shaped piece is arranged to be thermally in contact with the first arc-shaped piece and capable of sliding and rotating relative to the first arc-shaped piece. Accordingly, thermal energy can be transferred from the shell body having a heat unit to the other shell body, thereby increasing the heat dissipation efficiency of the electronic device.


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