The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Aug. 26, 2016
Applicant:

Hosiden Corporation, Yao-shi, JP;

Inventors:

Takeshi Isoda, Yao, JP;

Koji Shinoda, Yao, JP;

Assignee:

HOSIDEN CORPORATION, Yao-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); H05K 7/02 (2006.01); H05K 13/04 (2006.01); G06F 3/038 (2013.01); G06F 1/16 (2006.01); G06F 3/041 (2006.01); B29C 33/12 (2006.01); H05K 5/02 (2006.01); B29K 667/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 7/02 (2013.01); B29C 33/126 (2013.01); B29C 45/14065 (2013.01); G06F 1/169 (2013.01); G06F 1/1656 (2013.01); G06F 3/038 (2013.01); G06F 3/041 (2013.01); H05K 5/0247 (2013.01); H05K 13/04 (2013.01); B29C 2045/14131 (2013.01); B29K 2667/003 (2013.01); B29L 2031/3481 (2013.01); Y10T 29/49117 (2015.01);
Abstract

The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.


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