The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Sep. 30, 2015
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jeong-Ho Lee, Suwon-si, KR;

Young-Do Kweon, Seoul, KR;

Hyoung-Joon Kim, Daejeon, KR;

Kyoung-Moo Harr, Jindo-gun, KR;

Kyung-Seob Oh, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H01L 23/52 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0094 (2013.01); H05K 1/181 (2013.01); H05K 3/4046 (2013.01); H01L 23/52 (2013.01); H01L 2224/16225 (2013.01); H05K 1/182 (2013.01); H05K 1/186 (2013.01); H05K 3/4694 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10545 (2013.01); Y02P 70/611 (2015.11);
Abstract

A printed circuit board including a circuit board having a cavity between an upper surface of the circuit board and a lower surface of the circuit board that are substantially parallel to each other, and a connection board including insulating layers substantially parallel with metal layers, the metal layers including metal patterns. The connection board is disposed in the cavity with the insulating layers and the metal layers of the connection board substantially perpendicular to the upper and lower surfaces of the circuit board.


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