The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Dec. 12, 2016
Applicant:
Schweizer Electronic Ag, Schramberg, DE;
Inventors:
Thomas Gottwald, Dunningen-Seedorf, DE;
Christian Rössle, St. Georgen, DE;
Assignee:
SCHWEIZER ELECTRONIC AG, Schramburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H01L 23/64 (2006.01); H02K 9/22 (2006.01); H05K 3/46 (2006.01); H02K 11/30 (2016.01); H02K 11/33 (2016.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H01G 2/06 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/645 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H02K 9/22 (2013.01); H02K 11/30 (2016.01); H02K 11/33 (2016.01); H05K 1/0204 (2013.01); H05K 1/0271 (2013.01); H05K 1/18 (2013.01); H05K 1/184 (2013.01); H05K 3/0044 (2013.01); H05K 3/30 (2013.01); H05K 3/40 (2013.01); H05K 3/4038 (2013.01); H05K 3/4602 (2013.01); H01G 2/065 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/211 (2013.01); H01L 2224/2105 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19106 (2013.01); H05K 3/0061 (2013.01); H05K 3/3442 (2013.01); H05K 3/4092 (2013.01); H05K 2201/0397 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2203/0228 (2013.01);
Abstract
An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.