The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Jan. 03, 2014
Applicant:

Harman International Industries, Inc., Stamford, CT (US);

Inventors:

John C Baumhauer, Jr., Indianapolis, IN (US);

Fengyuan Li, Carmel, IN (US);

Larry A. Marcus, Fishers, IN (US);

Alan D. Michel, Carmel, IN (US);

Marc Reese, Indianapolis, IN (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 1/04 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 1/38 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 1/38 (2013.01); H04R 31/00 (2013.01);
Abstract

In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.


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