The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Sep. 20, 2016
Applicant:
Raytheon Company, Waltham, MA (US);
Inventor:
Matthew J. Wargo, Tucson, AZ (US);
Assignee:
Raytheon Company, Waltham, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01P 11/00 (2006.01); H05K 1/02 (2006.01); F16B 11/00 (2006.01); H01Q 21/06 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/087 (2013.01); F16B 11/006 (2013.01); H01P 3/081 (2013.01); H01P 11/003 (2013.01); H01Q 21/064 (2013.01); H01Q 23/00 (2013.01); H05K 1/0242 (2013.01);
Abstract
A flat plate assembly is provided from at least a pair of plates with at least one surface of one plate have one or more relief channels provided therein around epoxy bonded signal channels. The relief channels are provided having a size and shape selected to control the flow of a liquid bonding adhesive. Adhesive location can thus be controlled through geometry of the relief channels rather than through process controls. Thus, this approach reduces dependence on adhesive process control, reduces wicking of adhesive into signal channels and reduces the number of voids in a bond line of a bonded flat plate assembly.