The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Nov. 28, 2017
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Ryoji Naka, Tokushima, JP;

Atsushi Bando, Itano-gun, JP;

Tomohide Miki, Tokushima, JP;

Kimihiro Miyamoto, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/08 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/08 (2013.01); H01L 33/48 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/8592 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting device includes a package having a recess which includes a bottom surface and an inner peripheral surface around a periphery of the bottom surface. The package includes a first lead to define a first part of the bottom surface, a second lead to define a second part of the bottom surface, and a resin body to provide the inner peripheral surface and a remaining part of the bottom surface. The bottom surface includes a light emitting element mounting region in the first part and a groove surrounding the light emitting element mounting region. A light emitting element is mounted on the light emitting element mounting region. A light-transmissive resin is provided in the recess to be in at least a part of a groove surface. A light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin.


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