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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10153337 B1

PDFFull Text
Date of Patent:
Dec. 11, 2018

Filed:

Dec. 23, 2017

Flexible display device and method for manufacturing the same

Applicant:

Lg Display Co., Ltd., Seoul, KR;

Inventors:

Chanwoo Lee, Paju-si, KR;

Jonghyun Park, Goyang-si, KR;

Sungjoon Min, Gimpo-si, KR;

Kwonhyung Lee, Seoul, KR;

Assignee:

LG Display Co., Ltd., Seoul, KR;

Attorney:

Polsinelli PC

Primary Examiner:

Fei Fei Yeung Lopez

Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 51/52 (2006.01); H01L 25/18 (2006.01); H01L 51/56 (2006.01); H01L 25/00 (2006.01); G09G 3/3266 (2016.01); G09G 3/3275 (2016.01); H01L 23/535 (2006.01); H01L 23/538 (2006.01); H01L 23/52 (2006.01); H01L 51/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3279 (2013.01); G09G 3/3266 (2013.01); G09G 3/3275 (2013.01); H01L 23/52 (2013.01); H01L 23/535 (2013.01); H01L 23/538 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); G09G 2310/08 (2013.01); H01L 25/167 (2013.01); H01L 51/003 (2013.01); H01L 2227/323 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01);
Abstract

A flexible display device comprises a substrate having a flat portion and a curved portion, wherein a pixel array is provided in the flat portion and a pad portion connected to the pixel array is provided in the curved portion; and an encapsulation layer provided on the substrate to cover the pixel array, wherein the encapsulation layer comprises a terminal portion; an Integrated Circuit (IC) portion having at least one driving IC; and a lead portion having leads which connect the terminal portion and the driving IC portion, and wherein the curved portion of the substrate is bent so that the pad portion and the terminal portion are in contact with each other.

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