The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Feb. 15, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Nam-Gun Kim, Yongin-si, KR;

Chanmi Lee, Suwon-si, KR;

Joonkyu Rhee, Yongin-si, KR;

Ji-Hye Lee, Hwaseong-si, KR;

Taeseop Choi, Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 27/108 (2006.01); H01L 27/22 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10805 (2013.01); H01L 27/10814 (2013.01); H01L 27/10823 (2013.01); H01L 27/10852 (2013.01); H01L 27/10876 (2013.01); H01L 27/10882 (2013.01); H01L 27/10885 (2013.01); H01L 27/228 (2013.01); H01L 27/2436 (2013.01);
Abstract

Semiconductor devices and method of manufacturing the same are provided. The devices may include a substrate including a first impurity region and second impurity regions spaced apart from the first impurity region and a conductive line. The conductive line may extend in a first direction and may be electrically connected to the first impurity region. The devices may also include first conductive contacts on a side of the conductive line and arranged in the first direction and first insulation patterns on the side of the conductive line and arranged in the first direction. The first conductive contacts may be electrically connected to the second impurity regions. The first conductive contacts and the first insulation patterns may be alternately disposed along the first direction. Top surfaces of the first insulation patterns may be lower than a top surface of the conductive line relative to an upper surface of the substrate.


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