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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10153246 B1

PDFFull Text
Date of Patent:
Dec. 11, 2018

Filed:

Nov. 30, 2016

Method for producing member for semiconductor device and semiconductor device, and member for semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Shinji Sano, Matsumoto, JP;

Yoshihiro Kodaira, Matsumoto, JP;

Masayuki Soutome, Matsumoto, JP;

Kazunaga Onishi, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Eva Y Montalvo

Assistant Examiner:

Kevin Quinto

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/27 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/3735 (2013.01); H01L 23/48 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 21/4875 (2013.01); H01L 2224/2712 (2013.01); H01L 2224/2746 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2969 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29561 (2013.01); H01L 2224/321 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32501 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83395 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/014 (2013.01);
Abstract

There is provided a method for producing a member for semiconductor device which can reduce generation of a large number of voids in a solder-bonded portion without increasing production cost. The method includes the step of preparing a first member including a metal portion capable of being bonded by solder and the step of coating the surface of the metal portion of the first member with a treatment agent to form a treated coating which vaporizes at a temperature lower than or equal to the solidus temperature of the solder.

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