The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Jun. 06, 2017
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Jeong Do Yang, Yongin-si, KR;

Byoung Yong Kim, Seoul, KR;

Seung-Soo Ryu, Hwaseong-si, KR;

Sang Hyeon Song, Seoul, KR;

Jung Yun Jo, Namyangju-si, KR;

Seung-Hwa Ha, Hwaseong-si, KR;

Jeong Ho Hwang, Cheonan-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 23/29 (2006.01); H01L 23/522 (2006.01); H01L 23/525 (2006.01); H01L 23/532 (2006.01); H01L 27/12 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/707 (2013.01); H01L 23/293 (2013.01); H01L 23/5227 (2013.01); H01L 23/5252 (2013.01); H01L 23/53238 (2013.01); H01L 27/12 (2013.01); H01L 49/02 (2013.01);
Abstract

An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the pad electrode through a contact hole. The passivation layer includes an insulating portion having a first thickness and covering an adjacent edge region of the pad electrode and the substrate, and a bump portion having a second thickness, that is greater than the first thickness, and covering a center portion of the pad electrode.


Find Patent Forward Citations

Loading…