The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

May. 10, 2016
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Kazuhiko Fuse, Kyoto, JP;

Yoshio Ito, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); F27B 17/00 (2006.01); F27D 11/12 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); F27B 17/0025 (2013.01); F27D 11/12 (2013.01); H01L 21/6875 (2013.01);
Abstract

A plurality of support pins that support a semiconductor wafer are located upright on a top surface of a susceptor. A condenser lens is located on a bottom surface of the susceptor opposite to the support pins with respect to the susceptor. The condenser lens is located such that its optical axis coincides with the central axis of the corresponding support pin. Of light emitted from halogen lamps from below, light entering the condenser lens is condensed at a contact portion between the corresponding support pin and the semiconductor wafer, so that the vicinity of the contact portion rises in temperature. The vicinity of the contact portion of the semiconductor wafer in contact with the support pin in which the temperature tends to drop is relatively intensely heated in order to suppress the temperature drop, and an in-plane temperature distribution of the semiconductor wafer during light irradiation can thus be made uniform.


Find Patent Forward Citations

Loading…