The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Apr. 26, 2016
Applicant:

Meidensha Corporation, Tokyo, JP;

Inventors:

Shota Hayashi, Tokyo, JP;

Keita Ishikawa, Tokyo, JP;

Takaaki Furuhata, Shizuoka, JP;

Kenta Yamamura, Numazu, JP;

Kosuke Hasegawa, Numazu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 11/04 (2006.01); H01H 1/02 (2006.01); B22F 1/00 (2006.01); B22F 5/00 (2006.01); B22F 9/04 (2006.01); C22C 1/04 (2006.01); C22C 9/00 (2006.01); C22C 27/06 (2006.01); H01H 1/025 (2006.01); H01H 33/662 (2006.01); H01H 33/664 (2006.01);
U.S. Cl.
CPC ...
H01H 1/0206 (2013.01); B22F 1/00 (2013.01); B22F 1/0003 (2013.01); B22F 5/00 (2013.01); B22F 9/04 (2013.01); C22C 1/04 (2013.01); C22C 1/0425 (2013.01); C22C 9/00 (2013.01); C22C 27/06 (2013.01); H01H 1/025 (2013.01); H01H 11/048 (2013.01); H01H 33/662 (2013.01); H01H 33/664 (2013.01); B22F 2301/10 (2013.01); H01H 11/04 (2013.01); H01H 2201/03 (2013.01);
Abstract

It is a method for producing an electrode material containing Cu, Cr and a heat-resistant element. A heat-resistant element powder and a Cr powder are mixed together such that the heat-resistant element is less than the Cr by weight. A resulting mixed powder is baked. A resulting sintered body containing a solid solution of the heat-resistant element and the Cr is pulverized, and a resulting solid solution powder is classified, to have a particle size of 200 μm or less. 10-60 parts by weight of the classified solid solution powder and 90-40 parts by weight of a Cu powder are mixed together, followed by sintering to obtain the electrode material. If a low melting metal powder having a median size of 5-40 μm is mixed with a mixed powder of the solid solution powder and the Cu powder, the deposition resistance property is further improved.


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