The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Oct. 20, 2016
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Shinji Otani, Nagaokakyo, JP;
Masaki Tsutsumi, Nagaokakyo, JP;
Yoshinori Ueda, Nagaokakyo, JP;
Hayami Kudo, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01C 7/00 (2006.01); H01C 17/28 (2006.01); H01F 1/03 (2006.01); H01F 27/255 (2006.01); H01F 41/02 (2006.01); H01G 4/008 (2006.01); H01G 4/252 (2006.01); H01G 4/40 (2006.01); H01L 41/047 (2006.01); H01G 4/33 (2006.01); H01C 1/14 (2006.01); H01C 7/18 (2006.01); H01G 4/232 (2006.01); H01G 4/236 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01C 1/14 (2013.01); H01C 7/008 (2013.01); H01C 7/18 (2013.01); H01C 17/28 (2013.01); H01F 1/0306 (2013.01); H01F 17/0013 (2013.01); H01F 17/0033 (2013.01); H01F 17/04 (2013.01); H01F 27/255 (2013.01); H01F 27/2804 (2013.01); H01F 41/0206 (2013.01); H01G 4/008 (2013.01); H01G 4/232 (2013.01); H01G 4/236 (2013.01); H01G 4/2325 (2013.01); H01G 4/252 (2013.01); H01G 4/33 (2013.01); H01G 4/40 (2013.01); H01L 41/0477 (2013.01); H01F 2017/048 (2013.01); H05K 1/165 (2013.01);
Abstract
An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.