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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10153082 B1

PDFFull Text
Date of Patent:
Dec. 11, 2018

Filed:

Oct. 20, 2016

Electronic component and method of manufacturing electronic component

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Shinji Otani, Nagaokakyo, JP;

Masaki Tsutsumi, Nagaokakyo, JP;

Yoshinori Ueda, Nagaokakyo, JP;

Hayami Kudo, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Ronald Hinson

Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01C 7/00 (2006.01); H01C 17/28 (2006.01); H01F 1/03 (2006.01); H01F 27/255 (2006.01); H01F 41/02 (2006.01); H01G 4/008 (2006.01); H01G 4/252 (2006.01); H01G 4/40 (2006.01); H01L 41/047 (2006.01); H01G 4/33 (2006.01); H01C 1/14 (2006.01); H01C 7/18 (2006.01); H01G 4/232 (2006.01); H01G 4/236 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01C 1/14 (2013.01); H01C 7/008 (2013.01); H01C 7/18 (2013.01); H01C 17/28 (2013.01); H01F 1/0306 (2013.01); H01F 17/0013 (2013.01); H01F 17/0033 (2013.01); H01F 17/04 (2013.01); H01F 27/255 (2013.01); H01F 27/2804 (2013.01); H01F 41/0206 (2013.01); H01G 4/008 (2013.01); H01G 4/232 (2013.01); H01G 4/236 (2013.01); H01G 4/2325 (2013.01); H01G 4/252 (2013.01); H01G 4/33 (2013.01); H01G 4/40 (2013.01); H01L 41/0477 (2013.01); H01F 2017/048 (2013.01); H05K 1/165 (2013.01);
Abstract

An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.

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Otani, Shinji. (2018). Electronic component and method of manufacturing electronic component (U.S. Patent No. 10153082). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10153082

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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