The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Feb. 09, 2018
Applicant:

Sae Magnetics (H.k.) Ltd., Hong Kong, CN;

Inventors:

Ryo Hosoi, Hong Kong, CN;

Seiichi Takayama, Hong Kong, CN;

Takashi Honda, Hong Kong, CN;

Assignee:

SAE MAGNETICS (H.K.) LTD., Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/09 (2006.01); G11B 5/48 (2006.01); G11B 5/60 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4866 (2013.01); G11B 5/6082 (2013.01); G11B 2005/0021 (2013.01);
Abstract

A light source unit for thermally-assisted magnetic head includes a support member and a light source attached on the support member via a solder, and the light source unit further includes a positioning structure formed between the support member and the light source for positioning the light source and the solder. The light source unit can maintain stable height control of the light source, prevent solder over flow and prevent the light source from shifting and moving during the bonding process.


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