The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Mar. 02, 2017
Applicant:

Beihang University, Beijing, CN;

Inventors:

Xiaowu Chen, Beijing, CN;

Kan Guo, Beijing, CN;

Qinping Zhao, Beijing, CN;

Assignee:

BEIHANG UNIVERSITY, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/34 (2006.01); G06T 7/11 (2017.01); G06T 7/60 (2017.01); G06T 17/00 (2006.01);
U.S. Cl.
CPC ...
G06T 7/11 (2017.01); G06T 7/60 (2013.01); G06T 17/00 (2013.01); G06T 2200/04 (2013.01);
Abstract

Presently disclosed is a method for co-segmenting three-dimensional models represented by sparse and low-rank feature, comprising: pre-segmenting each three-dimensional model of a three-dimensional model class to obtain three-dimensional model patches for the each three-dimensional model; constructing a histogram for the three-dimensional model patches of the each three-dimensional model to obtain a patch feature vector for the each three-dimensional model; performing a sparse and low-rank representation to the patch feature vector for the each three-dimensional model to obtain a representation coefficient and a representation error of the each three-dimensional model; determining a confident representation coefficient for the each three-dimensional model according to the representation coefficient and the representation error of the each three-dimensional model; and clustering the confident representation coefficient of the each three-dimensional model to co-segment the each three-dimensional model respectively.


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