The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Jul. 01, 2015
Applicant:

Dongwoo Fine-chem Co., Ltd., Iksan-si, Jeollabuk-do, KR;

Inventors:

Yong Hwan Kim, Anseong-si, KR;

Euk Kun Yoon, Hwaseong-si, KR;

Yong Seok Choi, Jeonju-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/045 (2006.01); G06F 3/044 (2006.01); B05D 1/02 (2006.01); B05D 1/18 (2006.01); B05D 1/28 (2006.01); B05D 1/32 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); B05D 1/02 (2013.01); B05D 1/18 (2013.01); B05D 1/28 (2013.01); B05D 1/32 (2013.01); G06F 2203/04103 (2013.01);
Abstract

The present invention relates to a thick-film pattern structure formed by repeating a stacking process, specifically a thick-film pattern structure having a reduced taper angle at a pattern edge region after all layers of the same material are stacked in gradually reducing pattern widths, and a method of forming the thick-film pattern structure. The thick-film pattern structure according to the present invention comprises a thick-film pattern coating layer having a pattern width; and multiple thick-film pattern coating layers sequentially stacked on the thick-film pattern coating layer to have gradually reducing pattern widths at an edge region of the thick-film pattern coating layers, wherein the thick-film pattern coating layers provide a thick-film pattern having a stepped shape.


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