The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Jan. 12, 2015
Qualcomm Incorporated, San Diego, CA (US);
Unnikrishnan Vadakkanmaruveedu, Phoenix, AZ (US);
Jon James Anderson, Boudler, CO (US);
Vinay Mitter, San Diego, CA (US);
Peng Wang, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (C) for the material, such that k*ρ*Cis between 0 (J*W)/(m*K) and 1,000,000 (J*W)/(m*K). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m, and a specific heat between 1900-2000 J/kg-K.