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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10151977 B1

PDFFull Text
Date of Patent:
Dec. 11, 2018

Filed:

Feb. 12, 2016

Resin composition, resin film, and electronic device

Applicant:

Zeon Corporation, Tokyo, JP;

Inventors:

Takashi Tsutsumi, Tokyo, JP;

Yumi Osaku, Tokyo, JP;

Assignee:

ZEON CORPORATION, Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
G03F 7/38 (2006.01); G03F 7/038 (2006.01); H01L 21/027 (2006.01); C08K 5/1515 (2006.01); C08K 5/3492 (2006.01); C08L 45/00 (2006.01); C08L 79/08 (2006.01); C08L 83/04 (2006.01); C08L 101/00 (2006.01); G03F 7/023 (2006.01); C08K 5/09 (2006.01); C08K 5/5435 (2006.01); G03F 7/022 (2006.01); G03F 7/075 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); C08K 5/09 (2013.01); C08K 5/1515 (2013.01); C08K 5/3492 (2013.01); C08K 5/5435 (2013.01); C08L 45/00 (2013.01); C08L 79/08 (2013.01); C08L 83/04 (2013.01); C08L 101/00 (2013.01); G03F 7/023 (2013.01); G03F 7/0226 (2013.01); G03F 7/0233 (2013.01); G03F 7/0382 (2013.01); G03F 7/0387 (2013.01); G03F 7/0755 (2013.01); G03F 7/0757 (2013.01); H01L 21/0271 (2013.01);
Abstract

A resin composition comprising a binder resin (A), a compound (B) having an acidic group or latent acidic group, an organic solvent (C), and a compound (D) having one atom selected from a silicon atom, titanium atom, aluminum atom, and zirconium atom and having a hydrocarbyloxy group or hydroxy group bonded with that atom, wherein the compound (B) is at least one type selected from the group consisting of an aliphatic compound, aromatic compound, and heterocyclic compound, and a content of the compound (B) is 0.1 to 2.5 parts by weight and a content of the compound (D) is 2.2 to 7.0 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.

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