The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Aug. 17, 2015
Applicant:
Goo Chemical Co., Ltd., Kyoto, JP;
Inventors:
Yoshio Sakai, Shiga, JP;
Michiya Higuchi, Kyoto, JP;
Assignee:
GOO CHEMICAL CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); G03F 7/031 (2006.01); G03F 7/029 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/004 (2006.01); H05K 1/03 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/031 (2013.01); G03F 7/0043 (2013.01); G03F 7/029 (2013.01); G03F 7/038 (2013.01); G03F 7/0385 (2013.01); G03F 7/0388 (2013.01); G03F 7/2006 (2013.01); G03F 7/322 (2013.01); H05K 1/0274 (2013.01); H05K 1/0353 (2013.01); H05K 3/282 (2013.01); H05K 3/287 (2013.01); H05K 2201/0166 (2013.01);
Abstract
A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an α-hydroxy alkylphenone-based photopolymerization initiator.