The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Sep. 15, 2015
Applicant:

Sensitec Gmbh, Lahnau, DE;

Inventors:

Jochen Schmitt, Biedenkopf, DE;

Johannes Paul, Mainz, DE;

Ronald Lehndorff, Mainz, DE;

Jürgen Wahrhusen, Nieder-Hilbersheim, DE;

Claudia Glenske, Leun, DE;

Assignee:

SENSITEC GMBH, Lahnau, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/09 (2006.01); G01R 33/00 (2006.01); H01L 43/12 (2006.01); H01L 27/22 (2006.01); H01L 43/10 (2006.01);
U.S. Cl.
CPC ...
G01R 33/093 (2013.01); G01R 33/0052 (2013.01); G01R 33/098 (2013.01); H01L 27/22 (2013.01); H01L 43/10 (2013.01); H01L 43/12 (2013.01);
Abstract

A method and an apparatus are for the permanent magnetization of at least one ferromagnetic layer in a magnetic field sensor device deposited on a chip substrate. The method includes production of at least one resistance element on a chip substrate, deposition of at least one soft magnetic structuring element on the chip substrate; heating of the resistance element to above the blocking temperature and coupling of a preconditioning magnetic field; cooling of the resistance element to below the blocking temperature; and removal of the preconditioning magnetic field. The soft magnetic structuring element is arranged such that the coupled preconditioning magnetic field penetrates the structuring element substantially perpendicular to the chip surface and, at the location of the resistance element, generates magnetic field components parallel to the chip surface which penetrate the ferromagnetic layer of the resistance element at least in some areas.


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