The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Sep. 19, 2016
Applicant:

Nagano Keiki Co., Ltd., Tokyo, JP;

Inventors:

Nobutaka Yamagishi, Tokyo, JP;

Naoki Yamashita, Tokyo, JP;

Atsushi Imai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 7/08 (2006.01); G01L 9/00 (2006.01); G01L 19/00 (2006.01); G01L 19/06 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
G01L 7/082 (2013.01); G01L 9/0041 (2013.01); G01L 19/0038 (2013.01); G01L 19/0627 (2013.01); G01L 19/143 (2013.01);
Abstract

A pressure sensor includes a pressure sensor element, a joint provided to a target member, and an attachment member that is fitted into the joint through the connection section and connected to the target member. Each of the pressure sensor element and the joint is formed of a material that is not embrittled upon being in contact with a fluid to be measured that embrittles a material, and more rigid than the attachment member. The connection section is subjected to a plastic deformation connection (metal flow). An expensive hydrogen embrittlement resistant material is used for the pressure sensor element and the joint that are brought into contact with the fluid to be measured, and an inexpensive material is used for the attachment member that is not brought into contact with the fluid to be measured, thereby reducing the production cost of the pressure sensor.


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