The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Nov. 30, 2015
Applicant:
Sensirion Ag, Stafa, CH;
Inventors:
Assignee:
Sensirion AG, Stafa, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 15/14 (2006.01); G01F 1/69 (2006.01); G01F 1/684 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/34 (2006.01); G01F 1/688 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
G01F 1/688 (2013.01); G01F 1/684 (2013.01); G01F 1/6842 (2013.01); G01F 1/6845 (2013.01); G01F 1/69 (2013.01); G01F 15/14 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/34 (2013.01); H01L 23/345 (2013.01); H01L 23/49541 (2013.01); H01L 23/49838 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 23/3107 (2013.01); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/146 (2013.01); H01L 2924/1815 (2013.01);
Abstract
A flow sensor package comprises a chip comprising a sensitive structure for sensing the flow of a fluid and an encapsulation at least partly encapsulating the chip. A recess in the encapsulation contributes to a flow channel for guiding the fluid, which recess exposes at least the sensitive structure of the chip from the encapsulation, and which recess extends beyond an edge of the chip.