The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Apr. 03, 2014
Applicant:
Raytheon Company, Waltham, MA (US);
Inventor:
Adam C. Wood, Oro Valley, AZ (US);
Assignee:
Raytheon Company, Waltham, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 20/02 (2006.01); B23P 15/26 (2006.01); F28F 3/02 (2006.01); H01L 23/427 (2006.01); F28D 20/00 (2006.01); F28D 15/04 (2006.01); F28D 17/04 (2006.01); F28D 17/00 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28D 20/021 (2013.01); B23P 15/26 (2013.01); F28D 20/023 (2013.01); F28F 3/022 (2013.01); H01L 23/4275 (2013.01); F28D 15/046 (2013.01); F28D 17/00 (2013.01); F28D 17/04 (2013.01); F28D 2020/0008 (2013.01); F28D 2020/0013 (2013.01); F28D 2020/0017 (2013.01); F28D 2020/0021 (2013.01); F28D 2020/0026 (2013.01); F28D 2021/0029 (2013.01); H01L 2924/0002 (2013.01); Y02E 60/145 (2013.01); Y10T 29/4935 (2015.01);
Abstract
According to an embodiment of the disclosure, an encapsulated phase change material (PCM) heat sink is provided. The encapsulated PCM heat sink includes a lower shell, an upper shell, an encapsulated phase change material, and an internal matrix. The internal matrix includes a space that is configured to receive the encapsulated phase change material. Thermal energy is transferrable between the encapsulated phase change material and at least one of the lower shell and the upper shell. For a particular embodiment, the upper shell is coupled to the lower shell at room temperature and room pressure.