The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Jul. 14, 2015
Dow Global Technologies Llc, Midland, MI (US);
Glenn G. Eagle, Bloomfield Hills, MI (US);
Michael R. Golden, Waterford, MI (US);
Andreas Lutz, Galgenen, CH;
Dow Global Technologies LLC, Midland, MI (US);
Abstract
An uncured adhesive contains 2 to 10 weight percent of particles of a semi-crystalline organic material, preferably a polyester having a number-average molecular weight of 2000 to 10,000, a hydroxyl number of 10 to 60, and a melting temperature of 50 to 125° C. The adhesive is applied by heating it just prior to application, to melt the particles. After application, the adhesive is cooled to below the melting temperature of the semi-crystalline organic material, and then cured. The process allows the adhesive to be stored and pumped at ambient temperatures, due to the moderate viscosity of the material. Upon melting and re-cooling the semi-crystalline organic material, the adhesive assumes a high yield stress that imparts very good wash-off resistance. In preferred embodiments, the adhesive composition includes an epoxy resin and an epoxy curing agent.