The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Dec. 08, 2015
Applicant:

Kureha Corporation, Tokyo, JP;

Inventors:

Yasuhiro Suzuki, Tokyo, JP;

Naoko Kuriu, Tokyo, JP;

Shintaro Nomura, Tokyo, JP;

Tetsuo Ejiri, Tokyo, JP;

Shunzo Endo, Tokyo, JP;

Assignee:

Kureha Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/16 (2006.01); C08J 9/20 (2006.01); C08F 220/48 (2006.01); C08J 9/14 (2006.01); B01J 13/14 (2006.01);
U.S. Cl.
CPC ...
C08J 9/20 (2013.01); B01J 13/14 (2013.01); C08F 220/48 (2013.01); C08J 9/141 (2013.01); C08J 2201/026 (2013.01); C08J 2203/14 (2013.01); C08J 2203/182 (2013.01); C08J 2203/202 (2013.01); C08J 2433/20 (2013.01);
Abstract

Object: To provide thermally expandable microspheres having little sag. Resolution Means: The thermally expandable microspheres have a structure in which a foaming agent is encapsulated in an outer shell formed from a polymer, wherein, the ratio (%) of (R2/R1)×100 is at least 105%, where R1 is the expansion ratio after the thermally expandable microspheres have been heat-treated for 5 minutes at 150° C. and then foamed by heating for 2 minutes at 200° C., and R2 is the expansion ratio after the thermally expandable microspheres have been heat-treated for 5 minutes at 150° C. and then foamed by heating for 4 minutes at 200° C.


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