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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10150279 B1

PDFFull Text
Date of Patent:
Dec. 11, 2018

Filed:

Feb. 07, 2014

Panel laminating method, panel assembly and electronic device

Applicant:

Htc Corporation, Taoyuan County, TW;

Inventors:

Chu-Chun Lo, Taoyuan County, TW;

Hung-Wei Wu, Taoyuan County, TW;

Assignee:

HTC Corporation, Taoyuan County, TW;

Attorney:

JCIPRNET

Primary Examiner:

Daniel McNally

Int. Cl.
CPC ...
B32B 38/00 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
B32B 38/0008 (2013.01); B32B 7/12 (2013.01); B32B 37/1284 (2013.01); B32B 37/18 (2013.01); B32B 37/003 (2013.01); B32B 2037/1253 (2013.01); B32B 2250/02 (2013.01); B32B 2307/412 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/00 (2013.01); B32B 2457/202 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24752 (2015.01);
Abstract

A panel laminating method is provided with the following steps. A transparent adhesive layer is formed on a first panel. At least a portion of the transparent adhesive layer is pre-cured to increase the viscosity of the transparent adhesive layer. After the transparent adhesive layer is pre-cured, a second panel is stacked on the transparent adhesive layer. After the second panel is stacked on the transparent adhesive layer, the entire of the transparent adhesive layer is main-cured so that the second panel is laminated to the first panel through the transparent adhesive layer. Besides, a panel assembly and an electronic device are also provided.

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