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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10150277 B1

PDFFull Text
Date of Patent:
Dec. 11, 2018

Filed:

Dec. 07, 2016

Connection element, connection arrangement, method for producing a connection element and method for producing a connection arrangement

Applicant:

Airbus Defence and Space Gmbh, Taufkirchen, DE;

Inventor:

Thomas Meer, Glonn, DE;

Assignee:

Airbus Defence and Space GmbH, Taufkirchen, DE;

Attorney:

Jenkins, Wilson, Taylor & Hunt, P.A.

Primary Examiner:

Terressa Boykin

Int. Cl.
CPC ...
B29C 65/08 (2006.01); B32B 37/04 (2006.01); B32B 7/10 (2006.01); B32B 27/08 (2006.01); B32B 27/38 (2006.01); B29C 65/06 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
B32B 37/04 (2013.01); B29C 65/0627 (2013.01); B29C 65/0672 (2013.01); B29C 65/08 (2013.01); B32B 7/10 (2013.01); B32B 27/08 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/365 (2013.01); B32B 27/38 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2262/106 (2013.01); B32B 2270/00 (2013.01); B32B 2307/308 (2013.01); B32B 2310/027 (2013.01);
Abstract

A connection element includes a composite component with a cured epoxy resin, a first layer including a first thermoplastic polymer and an intermediate layer arranged between the composite component and the first layer, the first layer containing both the cured epoxy resin of the composite component and the first thermoplastic polymer of the first layer. The first thermoplastic polymer has a melting point above a curing temperature of the epoxy resin and is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component.

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Quick Actions:

Meer, Thomas. (2018). Connection element, connection arrangement, method for producing a connection element and method for producing a connection arrangement (U.S. Patent No. 10150277). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10150277

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