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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10150258 B1

PDFFull Text
Date of Patent:
Dec. 11, 2018

Filed:

Jul. 29, 2014

Additive manufacturing of embedded materials

Applicant:

Carnegie Mellon University, Pittsburgh, PA (US);

Inventors:

Adam Feinberg, Pittsburgh, PA (US);

Thomas Hinton, Pittsburgh, PA (US);

Assignee:

Carnegie Mellon University, Pittsburgh, PA (US);

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Jacob T Minskey

Assistant Examiner:

Baileigh Kate Darnell

Int. Cl.
CPC ...
B29C 64/106 (2017.01); A61L 27/38 (2006.01); B33Y 10/00 (2015.01); B29C 67/00 (2017.01); B29C 64/40 (2017.01); B29C 64/112 (2017.01); A61L 27/52 (2006.01); A61L 27/04 (2006.01); A61L 27/10 (2006.01); A61L 27/14 (2006.01); A61L 27/18 (2006.01); A61L 27/20 (2006.01); A61L 27/22 (2006.01); A61L 27/24 (2006.01); B33Y 70/00 (2015.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 67/0092 (2013.01); A61L 27/04 (2013.01); A61L 27/10 (2013.01); A61L 27/14 (2013.01); A61L 27/18 (2013.01); A61L 27/20 (2013.01); A61L 27/22 (2013.01); A61L 27/222 (2013.01); A61L 27/225 (2013.01); A61L 27/227 (2013.01); A61L 27/24 (2013.01); A61L 27/38 (2013.01); A61L 27/52 (2013.01); B29C 64/106 (2017.08); B29C 64/112 (2017.08); B29C 64/40 (2017.08); B29C 67/0055 (2013.01); B29C 67/0059 (2013.01); B33Y 10/00 (2014.12); B29K 2005/00 (2013.01); B29K 2089/00 (2013.01); B29L 2031/7532 (2013.01); B33Y 70/00 (2014.12);
Abstract

In one aspect, a method includes providing support material within which the structure is fabricated, depositing, into the support material, structure material to form the fabricated structure, and removing the support material to release the fabricated structure from the support material. The provided support material is stationary at an applied stress level below a threshold stress level and flows at an applied stress level at or above the threshold stress level during fabrication of the structure. The provided support material is configured to mechanically support at least a portion of the structure and to prevent deformation of the structure during the fabrication of the structure. The deposited structure material is suspended in the support material at a location where the structure material is deposited. The structure material comprises a fluid that transitions to a solid or semi-solid state after deposition of the structure material.

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