The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Apr. 23, 2013
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Toshiki Ito, Kawasaki, JP;

Akiko Iimura, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 35/08 (2006.01); G03F 7/00 (2006.01); H01L 21/027 (2006.01); B29C 59/02 (2006.01); C08F 112/08 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); B29K 25/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 35/0805 (2013.01); B29C 59/022 (2013.01); C08F 112/08 (2013.01); G03F 7/0002 (2013.01); H01L 21/0273 (2013.01); H05K 1/181 (2013.01); H05K 3/0082 (2013.01); H05K 3/064 (2013.01); B29C 2035/0827 (2013.01); B29K 2025/06 (2013.01); B29K 2025/08 (2013.01); B29K 2105/0002 (2013.01); B29K 2105/0085 (2013.01); B29K 2995/0027 (2013.01);
Abstract

Provided is a method for manufacturing a photo cured material, by which transferring precision can be improved and a small surface roughness can be obtained. The method includes the steps of: placing a photo-curable composition on a substrate; brining a mold into contact with the photo-curable composition; irradiating the photo-curable composition with light; and releasing the mold from the photo-curable composition. The contact is performed in a condensable gas atmosphere, the condensable gas condensing under a temperature condition at the contact and under a pressure condition that the condensable gas receives when the photo-curable composition intrudes gaps between the substrate and the mold or concavities provided on the mold, and the photo-curable composition includes a gas dissolution inhibitor having a rate of weight change with reference to the condensable gas that is −1.0% to 3.0%.


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