The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Jun. 06, 2016
Applicant:
National Tsing Hua University, Hsinchu, TW;
Inventors:
Kuan-Ting Lee, Hsinchu, TW;
Shih-Yuan Lu, Hsinchu, TW;
Assignee:
National Tsing Hua University, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 23/58 (2006.01); B01J 23/745 (2006.01); B01J 35/00 (2006.01); B01J 37/00 (2006.01); B01J 37/03 (2006.01); B01J 37/04 (2006.01); C01G 49/00 (2006.01); C02F 1/72 (2006.01); B01J 23/889 (2006.01); B01J 23/00 (2006.01); B01J 23/70 (2006.01); B01J 23/80 (2006.01); B01J 23/835 (2006.01); B01J 23/89 (2006.01); C02F 1/32 (2006.01);
U.S. Cl.
CPC ...
B01J 23/745 (2013.01); B01J 23/005 (2013.01); B01J 23/70 (2013.01); B01J 23/80 (2013.01); B01J 23/835 (2013.01); B01J 23/8892 (2013.01); B01J 23/8906 (2013.01); B01J 35/002 (2013.01); B01J 35/004 (2013.01); B01J 35/0013 (2013.01); B01J 37/009 (2013.01); B01J 37/0072 (2013.01); B01J 37/036 (2013.01); B01J 37/038 (2013.01); B01J 37/04 (2013.01); C01G 49/0081 (2013.01); C02F 1/32 (2013.01); C02F 1/725 (2013.01); C01P 2002/72 (2013.01); C01P 2004/03 (2013.01); C01P 2006/90 (2013.01); C02F 2305/10 (2013.01); Y02W 10/37 (2015.05);
Abstract
A paste for manufacturing a photocatalyst is provided. The paste for manufacturing the photocatalyst includes an alcohol paste and a photocatalyst precursor. The photocatalyst precursor is dispersed in the alcohol paste, and the photocatalyst precursor includes a first metal precursor and a second metal precursor, wherein the first metal in the first metal precursor includes Zn, Sn, Cu, Fe, Mn, Ni, Co or Ag, and the second metal in the second metal precursor includes Fe.